JPS5577865U - - Google Patents
Info
- Publication number
- JPS5577865U JPS5577865U JP1978162137U JP16213778U JPS5577865U JP S5577865 U JPS5577865 U JP S5577865U JP 1978162137 U JP1978162137 U JP 1978162137U JP 16213778 U JP16213778 U JP 16213778U JP S5577865 U JPS5577865 U JP S5577865U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978162137U JPS5577865U (en]) | 1978-11-25 | 1978-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978162137U JPS5577865U (en]) | 1978-11-25 | 1978-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5577865U true JPS5577865U (en]) | 1980-05-29 |
Family
ID=29157555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978162137U Pending JPS5577865U (en]) | 1978-11-25 | 1978-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5577865U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296749A (ja) * | 1985-06-25 | 1986-12-27 | Toray Silicone Co Ltd | 半導体装置用リードフレームの製造方法 |
| JPH0650341U (ja) * | 1992-12-02 | 1994-07-08 | 株式会社三井ハイテック | 半導体装置 |
-
1978
- 1978-11-25 JP JP1978162137U patent/JPS5577865U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296749A (ja) * | 1985-06-25 | 1986-12-27 | Toray Silicone Co Ltd | 半導体装置用リードフレームの製造方法 |
| JPH0650341U (ja) * | 1992-12-02 | 1994-07-08 | 株式会社三井ハイテック | 半導体装置 |